【英文】美国商务部报告：美国芯片资助法案战略（21页）

英文研究报告 2022年10月09日 09:09 管理员

These objectives go beyond supporting the construction of a few semiconductor manufacturing facilities, or “fabs.” Over the long term, the CHIPS for America Fund must enable and sustain a vibrant domestic industry that supports quality jobs, a diverse workforce, and a robust supplier base of large and small firms, while revitalizing high-volume semiconductor manufacturing, renewing U.S. strengths in design, materials, and process innovation, and benefiting the broader economy. Achieving these goals will require new thinking and partnerships from policymakers and the private sector to unlock the productive capacity of industry, workers, and communities. This document describes the principles that will guide the Department’s program design, the industry context in which the CHIPS for America Fund will operate, the distinct initiatives within the Fund, and some considerations for future applicants for CHIPS funding that require long-term preparation. Statutory Background Sections 9902 and 9906 of the William M. (Mac) Thornberry National Defense Authorization Act for Fiscal Year 2021 (referenced herein as “the 2021 NDAA”2) authorized semiconductor manufacturing and R&D activities, collectively called the “CHIPS program” in this document.

The CHIPS Act of 2022 enhanced the CHIPS program with new authorities and appropriated $50 billion to the Department to implement it.3 Section 9902 of the 2021 NDAA authorizes the Department to provide funding to eligible applicants to incentivize investment in facilities and equipment in the United States for the fabrication, assembly, testing, advanced packaging, production, or research and development of semiconductors, materials used to manufacture semiconductors, or semiconductor manufacturing equipment.4 The Department may provide funding in various forms, including grants, cooperative agreements, loans, and loan guarantees.5 The CHIPS Act of 2022 appropriates $39 billion for these purposes.6 With these funds, the Department will establish an incentives program to support the expansion of manufacturing capacity for mature nodes and to attract large-scale investments in advanced technologies such as leading-edge logic and memory. Section 9906 of the 2021 NDAA authorizes the Department to establish a National Semiconductor Technology Center (NSTC) to conduct research and prototyping of advanced semiconductor technology and to establish a National Advanced Packaging Manufacturing Program (the “Advanced Packaging” program or “NAPMP”) led by the director of the Department’s National Institute of Standards and Technology (NIST).