【英文】德国外交关系理事会报告：中国的数字力量对欧盟的影响评估（106页）

英文研究报告 2022年02月24日 07:49 管理员

Historically, integrated device manufacturers (IDM), such as Infineon, NXP or ST Microelectronics, took care of ATP inhouse in their own back-end fabs. Backend processes are also often outsourced to foundries such as TSMC or Globalfoundries, however, or to specialist outsourced semiconductor assembly and test (OSAT) companies such as ASE Group or Amkor Technologies.30 The economics of back-end manufacturing – relatively labour-intensive with low value-add and narrow profit margins – led increasingly to it being outsourced to China, Taiwan and other countries in Southeast Asia. While the back-end market is substantially less concentrated by market share than cutting edge frontend manufacturing, it is to some extent geographically concentrated. More than 60% of global ATP capacity is currently located in Taiwan and China,31 which includes the back-end fabs of Western companies located in China and Taiwan.

Chinese OSAT companies have been especially successful, growing their global market share to around 20% by 2020.The back end of the semiconductor value chain is receiving sustained attention from policymakers in China. The Chinese state, from senior leaders in Beijing down through provincial and municipal governments, is focused on promoting coordinated development of the entire value chain, including investment in ATP capacity expansion and technological advances.34 This presents challenges for Europe – in terms not just of the semiconductor value chain, but also of the multiple industries and technological ecosystems built on it. It has far-reaching implications for national security and the global balance of economic, political and ideational power.